abstract |
The present invention provides a kind of The compound is characterized by having an aromatic ring structure and a group having a plurality of specific carbon-carbon triple bond structures.n n n In addition, the present invention provides a specific structure containing the present invention The composition of the compound, the cured product containing the composition, and the laminate having the cured product layer.n n n In addition, the present invention provides a feature that contains The composition of the compound is a composition for heat-resistant materials, and a composition for electronic materials. |