http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I709814-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2018-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cff897dee627a949144715f3f5c0b990 |
| publicationDate | 2020-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I709814-B |
| titleOfInvention | Photosensitive resin composition, method for manufacturing hardened relief pattern, and semiconductor device |
| abstract | The present invention provides a photosensitive resin composition, a method for forming a cured embossed pattern using the photosensitive resin composition, and a semiconductor device having the cured embossed pattern. The photosensitive resin composition provides Deviations also show good resolution, and show good chemical resistance, which suppresses the deterioration of the molding resin or the hardened relief pattern that reduces the adhesion.nThe photosensitive resin composition of the present invention is characterized by containing: (A) a polyimide precursor; and (B) a photopolymerization initiator, which uses a 0.001 wt% solution of N-methyl-2-pyrrolidone as a solvent The g-ray absorbance is 0.01~0.1. |
| priorityDate | 2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 355.