http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I709663-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate | 2016-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b76ba9152938c54fa676df218dcd91f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_246f9ca18dae74f5d5d98f55040ea529 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9858f9a285a68fc1f921660d883b159e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d0ebc12e61d6392ebe8a374646e0f95 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1669dae940c354f55580d6da223da8bb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24eb26d85f7c924bbdeae27b2ca35a44 |
| publicationDate | 2020-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I709663-B |
| titleOfInvention | Plating bath composition for electroless plating of gold, method for depositing a gold layer and use of ethylenediamine derivative |
| abstract | An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative as plating enhancer compound according to formula (I) n nwherein the residues R 1 and R 2 comprise 2 to 12 carbon atoms and nare selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R 1 and R 2 are the same or different and a method of depositing of gold. The electroless aqueous gold plating bath is suitable to provide soft gold layers useful for wire bonding and soldering applications which are required for electronic components. |
| priorityDate | 2015-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.