| abstract |
In the past, for inorganic fillers, alumina was widely used, and it is known that spinel, which has lower thermal conductivity than the aforementioned alumina, is used in gems, fluorescent light emitters, catalyst carriers, adsorbents, photocatalysts, heat-resistant insulating materials, etc. It is used as a thermally conductive inorganic filler. Therefore, the present invention aims to provide spinel particles with excellent thermal conductivity.nn n n A spinel particle comprising magnesium atoms, aluminum atoms, oxygen atoms, and molybdenum, and the crystal grain diameter of the [111] plane is 220 nm or more. |