| abstract |
The present invention provides a laminate, a printed wiring board using the same, a flexible printed wiring board, and a molded product. The laminate system has a primer layer (B) and a metal nanoparticle layer laminated on a support (A) in this order (C) and the laminate of the metal plating layer (D), characterized in that the primer layer (B) contains three amino groups The layer of cyclic compound (b1). The laminated system can be manufactured by a simple method without roughening the surface of the support, and the adhesion between the support and the metal layer (metal plating layer) is excellent. |