http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I707067-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a7d68c0925ad0c9068f497500f781377 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P10-20 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2019-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4536de4acc945e75838110aaf0230f99 |
| publicationDate | 2020-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I707067-B |
| titleOfInvention | Method and device for producing electroplating solution or electroplating replenishing solution for insoluble anode acid copper electroplating process |
| abstract | The present invention discloses a method for producing electroplating solution or electroplating replenishment solution in an insoluble anode acid copper electroplating process, which comprises the following steps: (1) An electrolytic cell is set up, and the electrolytic cell diaphragm is used to separate the electrolytic cell into an electrolytic anode zone and an electrolytic cathode zone; (2) Prepare the anolyte and catholyte separately; (3) add the anolyte to the electrolysis anode zone, and add the catholyte to the electrolysis cathode zone; (4) add the electrolysis anode Dip into the anolyte solution; immerse the electrolytic cathode in the catholyte solution; (5) connect the electrolysis anode and the electrolysis cathode to the positive and negative electrodes of the electrolysis power supply, and switch on the electrolysis power supply , Power on to start the electrolysis reaction, and when the copper ion concentration in the anolyte reaches a predetermined value, the anolyte is taken out. The invention also discloses a device for realizing the electroplating solution or electroplating liquid supplement production method suitable for the insoluble anode acid copper electroplating process. |
| priorityDate | 2018-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.