| abstract |
A photosensitive resin composition is provided in the present disclosure. The photosensitive resin composition includes, in parts by weight, 100 parts of modified polyvinyl alcohol, 10 to 50 parts of a photosensitive monomer, 5 to 15 parts of a photoinitiator, 1 to 20 parts of a colorant, 5 to 30 parts of inorganic filler powder and 10 to 50 parts of a blocked polyisocyanate, and an organic solvent. The blocked polyisocyanate is obtained by blocking an isocyanate group in a polyisocyanate with a blocking agent. The blocking agent deblocks the blocked polyisocyanate to give active isocyanate groups after the blocked polyisocyanate is heated to a deblocking temperature above 100 ℃. A method of preparing the photosensitive resin composition is also provided. |