| abstract |
The present invention provides a photosensitive polyimide resin composition comprising (a) polyimide represented by formula (1), (b) a filler having a particle size of 10 nm~1.0 μm selected from one or more of aluminum oxide, graphene, inorganic clay, silica, and zinc oxide, (c) photo radical initiator, (d) radical polymerizable compound, and (e) solvent for dissolving the polyimide, n nin which x is derived from a tetracarboxylic acid, y is derived from a diamine, and m is a positive integer of 1~5000. |