http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I705898-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-26 |
| filingDate | 2015-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bce38d0a5a8d9154264c4e7496584147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02d7e62706b56bb1b87d28c79269c6d2 |
| publicationDate | 2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I705898-B |
| titleOfInvention | Manufacturing method of laminated body |
| abstract | To provide a method for manufacturing a laminated body with a cured resin layer that is excellent in wiring embedding and can effectively prevent defects such as voids, and is excellent in production efficiency.nn n n n n A method of manufacturing a laminate is provided, which is a method of forming a hardened resin layer on a base material to produce a laminate, and is characterized by having the following steps: a first step, which is formed on a support and formed by heat A curable resin composition layer composed of a curable resin composition to obtain a curable resin composition layer with a support; the second step is to form the resin layer of the aforementioned curable resin composition layer with a support Surface contact with the substrate, by pressing and pressing to obtain a composite body composed of the substrate and the curable resin composition layer with support; the third step is to heat the composite body to harden the The resin composition layer is hardened to become a hardened resin layer; and the fourth step is to peel the support from the hardened resin layer; the second step includes: a first heating and pressure bonding step to attach the support The resin layer forming surface of the curable resin composition layer is in contact with the aforementioned substrate, and is press-bonded at the first heating temperature under reduced pressure; and the second heating and pressing step is performed in the aforementioned first heating and pressing After the bonding step, it is further pressurized and pressed at the second heating temperature; the first heating temperature of the first heating and pressing step is set to be higher than that before the second heating and pressing stepnThe second heating and pressing temperature is higher. |
| priorityDate | 2015-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.