| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5cdc78818ef5551721ef8e7d35612a08 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83907
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S2304-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81907
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0425 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2019-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b454feff564cc3f107bbd69a265b6d8a |
| publicationDate |
2020-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I705741-B |
| titleOfInvention |
Method for binding micro device on substrate |
| abstract |
A method for binding a micro device on a substrate is provided. The method includes forming a conductive pad on the substrate; forming an elevated bonding layer on the conductive pad; adjusting a temperature of the elevated bonding layer in an environment comprising a vapor such that at least a portion of the vapor is condensed to form a liquid layer on the elevated bonding layer; disposing the micro device over the elevated nbonding layer such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the elevated bonding layer, wherein the micro device comprises an electrode facing the elevated bonding layer; and evaporating the liquid layer such that the electrode is bound to the elevated bonding layer and is in electrical connection with the conductive pad. |
| priorityDate |
2019-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |