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filingDate 2019-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9ebab33895f63d042606145b3f93828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19943cb6f869cca4eca3d227a7220b4f
publicationDate 2020-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I705121-B
titleOfInvention Uv debondable pressure sensitive adhesive composition and pressure sensitive tape suitable for porous substrate
abstract The invention provides a UV debonding pressure-sensitive adhesive composition and an adhesive tape containing the same. The UV debonding pressure-sensitive adhesive composition comprises a polyacrylate pressure-sensitive adhesive, a UV-polymerizable polyurethane oligomer, a bridging agent and a free radical photoinitiator, wherein the polymerized monomer of the polyacrylate pressure-sensitive adhesive contains Epoxy functional acrylic monomer. The UV debonding pressure-sensitive adhesive composition greatly reduces the adhesive force after ultraviolet light irradiation, and when used on the surface of micropores, there is no residual glue in the micropores.
priorityDate 2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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