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filingDate 2016-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I704215-B
titleOfInvention Curable resin composition and optical semiconductor device
abstract A curable resin composition with high transparency, ultraviolet resistance and heat resistance in the ultraviolet region is provided.  The curable resin composition comprises an alkoxy oligomer having an average composition formula represented by formula (1), and a curing catalyst.  The curing catalyst is 3 to 30 parts by weight of H 3 nPO 4 nwith respect to 100 parts by weight of the alkoxy oligomer, or 0.5 to 20 parts by weight of a metal alkoxide with respect to 100 parts by weight of the alkoxy oligomer, wherein the metal of the metal alkoxide is at least one of B, Al, P, Sc, Ga, Y, Zr, Nb, In, Sn, La, Gd, Dy, Yb, Hf, Ta, and W.  In formula (1), R 1 n, R 2 n, R 3 n, R 4 n, R 5 n, and R 6 nare organic groups which are individualy the same or different from one another, each of w, x, y, and z is 0 or a positive number satisfing the equation w+x+y+z=1, and the atomic ratio of O to Si is 2.3 to 3.5. (R 1 nR 2 nR 3 nSiO 1/2 n) w n(R 4 nR 5 nSiO 2/2 n) x n(R 6 nSiO 3/2 n) y n(SiO 4/2 n) z n···(1)
priorityDate 2015-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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