| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa6e4421d9e1159b6012d9bf702be572 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate |
2019-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccf1affab0f93baeeeed60dbbf6aa8ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf872912a983d37c4ecf9018ec2660b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed57131b4dfe2ad2d3243e27db0bca2f |
| publicationDate |
2020-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I701316-B |
| titleOfInvention |
Conductive adhesive composition |
| abstract |
The object of the present invention is to provide a conductive adhesive composition having excellent thermal conductivity and migration resistance. The present invention relates to a conductive adhesive composition containing a conductive filler (A) and a binder composition (B) comprising silver powder (a1) and silver-coated copper powder (a2), wherein the silver-coated copper powder ( a2) Contains 3-65% by mass relative to the total amount of the conductive filler (A), and the conductive filler (A) contains 95-99.95% by mass relative to the total amount of non-volatile components in the conductive adhesive composition of. |
| priorityDate |
2018-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |