http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I701149-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 |
| filingDate | 2016-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a76c5f7e95ae277ee2476a50273c407 |
| publicationDate | 2020-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I701149-B |
| titleOfInvention | Manufacturing method of laminated body, manufacturing method of semiconductor element |
| abstract | The present invention provides a method for manufacturing a layered body, a method for manufacturing a semiconductor element, and a layered body. The layered body is a layered body that can mechanically peel a carrier substrate at room temperature, has reduced voids, and has excellent peel force stability. A method for manufacturing a laminate including a first member having a carrier substrate and a second member having a processing substrate, and having a temporary adhesive on the surface of at least one of the first member and the second member The agent layer includes pressure bonding of the first member and the second member under the air pressure P1, and then heating under the air pressure P2 at a temperature T2 exceeding 40° C., and then processing the processed substrate to form a laminate. |
| priorityDate | 2015-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 421.