| abstract |
This invention provides an electronic package which employs a cladding layer to clad an intermediary board with conductive perforations and a plurality of conductive columns, and the electronic component is disposed on the cladding layer and electrically connected to the conductive columns and the conductive perforations, decreasing the number of conductive perforations by using the conductive columns as an electrical transmission path of a part of the electrical functions of the electronic component to further reduce the process time and the cost of chemicals. In addition, a small-sized intermediary board can be fabricated nto replace the conventional large-area silicon intermediary board to improve yield. |