| abstract |
An objective of this invention is to provide a semiconductor device having adhered article being adhered by cured article of adhesive, wherein, the adhesive is capable of suppressing the lowering of adhesion strength in humidity-resistance test after the adhesion is cured. n n The semiconductor device of the present invention are formed of at least two adhered articles 20 and 70, 70 and 60, 70 and 50 being adhered by a cured article 10 of adhesive containing (A) a thermal setting resin, (B) a specific thiol compound and (C) a potential curing agent, wherein, at least two of the adhered article are formed of at least one material selected from the group consisting of engineering plastic, ceramics and metal. |