http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I694757-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b258fa1af98cc3086a2292794b41720f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 |
| filingDate | 2017-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a77ec50da732871c7468653221b6bf8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e3d9526f59c1c9526a07a8a1f4fd7a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e62b537cb7b30576e1035b7fac1c0e84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b057ff6b87f75eaba106c3ffdee0d85 |
| publicationDate | 2020-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I694757-B |
| titleOfInvention | Composite metal foil, copper-clad laminate using the composite metal foil, and method for manufacturing the copper-clad laminate |
| abstract | The present invention aims to provide a composite metal foil which can be used to produce a copper-clad laminate in which a very thin and dense copper layer laminated with a very thin and dense pinhole that is less prone to pinholes can be produced by a simple method. When a copper layer is used as a seed layer to form a circuit by an addition method, the seed layer can be etched and removed in a short time, so that the circuit can be suppressed from being etched, and when the multilayer substrate is manufactured using the copper-clad laminate, the entire multilayer substrate can be suppressed Thickened to form a high-density multilayer substrate. The composite metal foil of the present invention is sequentially laminated with a metal foil carrier, a first Ni or Ni alloy layer on at least one surface of the metal foil carrier, and a peeling layer on at least one surface of the first Ni or Ni alloy layer , A second Ni layer and an ultra-thin copper layer, the primary particle diameter of the copper particles of the ultra-thin copper layer is 10 to 200 nm, the adhesion amount is 300 to 6000 mg/m 2 , and the thickness of the second Ni layer is 0.3 ~5mm. |
| priorityDate | 2016-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.