| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01437b784a36a7da4db1492fa0f68abe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73795410d22c75b1831b6769c8ca01f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0783 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
2018-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93612f6caeb1759a7daedac31f407b6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b37adfefc94f2cad10f423c02f0417f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bfc43c1b0837b941c62b26511fab784 |
| publicationDate |
2020-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I693001-B |
| titleOfInvention |
Flexible circuit board and manufacturing method of the flexible circuit board |
| abstract |
The invention provides a method for manufacturing a flexible circuit board. The method for manufacturing the flexible circuit board comprises a plurality of steps as follow: providing a substrate; coating an adhesive solution on opposite sides of the substrate by coating and drying to form two adhesive layers; Forming a first copper layer and a second copper layer on the surface of each of the two adhesive layers facing away from the substrate; etching the first copper layer and the second copper layer to form the first signal line layer and the second signal line layer, respectively; and the surface of the first signal line layer and the surface of the surface of the second signal line layer are respectively covered with an insulating layer. The flexible circuit board prepared by the above manufacturing method has low dielectric loss. In addition, the invention further provides a flexible circuit board. |
| priorityDate |
2018-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |