http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I691617-B

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filingDate 2015-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bce38d0a5a8d9154264c4e7496584147
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publicationDate 2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I691617-B
titleOfInvention Desmearing slag processing method and method for manufacturing multilayer printed circuit board
abstract An object of the present invention is to provide a method for removing dross that can sufficiently remove dross while suppressing the roughness of the substrate surface. The method for removing dross of the present invention is a method for removing dross from a substrate on which holes are formed, and includes the following steps: The first step for removing dross is to dissolve or decompose a part of the dross ; And the second slag removal treatment step, which is after the first slag removal treatment step, the substrate is subjected to ultrasonic treatment. In the second dross removal processing step, at least one of fluctuating the ultrasonic frequency during ultrasonic processing and relatively moving the ultrasonic oscillation source and the substrate in two or more directions is implemented.
priorityDate 2014-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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