http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I690957-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f8d5ee4a06179be6c04703536dee498 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-26 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J129-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0425 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-002 |
| filingDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29f2760a0f96609c4c5c2ec816402493 |
| publicationDate | 2020-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I690957-B |
| titleOfInvention | Stacked capacitor packaging structure without using a carbon glue layer and its stacked capacitor, and polymer composite layer |
| abstract | The present invention provides a stacked capacitor package structure without carbon layer and a stacked capacitor thereof, and a conductive polymer layer. The stacked capacitor includes a metal foil sheet, an oxide layer, a polymer composite layer and a silver paste layer. The oxide layer is formed on the outer surface of the metal foil sheet to totally enclose the metal foil sheet. The polymer composite layer is formed on the oxide layer to partially enclose the oxide layer. nThe silver paste layer is directly formed on the polymer composite layer to directly enclose the polymer composite layer. Therefore, the oxide layer and the polymer composite layer can be connected with each other to form a first connection interface between the oxide layer and the polymer composite layer, and the polymer composite layer and the silver paste layer can be connected with each other without carbon layer to form a second connection interface between the polymer composite layer and the silver paste layer. |
| priorityDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 154.