http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I690622-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 |
| filingDate | 2018-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a857384382826fac6b95f9cbeb981193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_310ed351370367f0fa3633055d91911a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_006744b444e58727a66b4aa16d9980a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25b80581dbdcafc7ba1d663b1893a9eb |
| publicationDate | 2020-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I690622-B |
| titleOfInvention | Electrolytic copper foil and its manufacturing method, copper-clad laminate, printed wiring board and its manufacturing method, and electronic equipment and its manufacturing method |
| abstract | The present invention is an electrolytic copper foil having a surface treatment layer other than a roughening treatment layer on the glossy surface side. In this electrolytic copper foil, set the root mean square height Sq of the surface of the surface treatment layer to 0.550 μm or less, and set the total amount of Zn, the total amount of Mo, or the total amount of Mo and Zn contained in the surface treatment layer 70 μg/dm 2 or more. Alternatively, the surface roughness Sa of the surface of the surface treatment layer is set to 0.470 μm or less, and the total amount of Zn contained in the surface treatment layer, the total amount of Mo, or the total amount of Mo and Zn is set to 70 μg/dm 2 or more. |
| priorityDate | 2017-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 109.