| abstract |
The invention discloses a method for manufacturing a conductive substrate having a base material and a conductive pattern provided on one main surface side of the base material. The method includes the following steps: forming a groove having a bottom surface exposing the base layer and a side surface including the surface of the groove forming layer by imprinting; and growing a metal plating layer from the base layer exposed to the bottom surface of the groove, thereby A conductive pattern layer is formed. |