http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I688826-B

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filingDate 2016-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95bd30f5122da5e425edf2d821c85a9e
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publicationDate 2020-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I688826-B
titleOfInvention Photosensitive colored resin composition, method for manufacturing heat-resistant colored resin film, and display device
abstract An object of the present invention is to provide a photosensitive colored resin composition and a heat-resistant colored resin film thereof, which are formed with a flattening film, an insulating layer, and a partition wall suitable for use in an organic light-emitting device or a display element It has high sensitivity, and has the function of absorbing visible light in the short wavelength region and suppressing the reflection of external light.nn n n A photosensitive colored resin composition comprising an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm. The photosensitive compound (b) includes a photosensitive compound (b1), which has a maximum absorption wavelength in the range of 350 nm or more and 450 nm or less in the wavelength range of 350 nm or more and 390 nm or less.
priorityDate 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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