http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I687296-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b657bae7c6ba14f228fefd2393ecc834 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-62 |
| filingDate | 2015-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9081416351ea6c29f48ab6acbbd4bd60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0426e9b2bd518c102eda8970309f525a |
| publicationDate | 2020-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I687296-B |
| titleOfInvention | Mold release film and method for manufacturing semiconductor package |
| abstract | The present invention provides a mold release film having excellent antistatic effect and good transparency even in a high-temperature environment, and a method for manufacturing a semiconductor package using the mold release film.nn n n A release film, which is placed on the surface of the mold that is in contact with the curable resin when the semiconductor element is placed in the mold and sealed with a curable resin to form a resin sealing portion to manufacture a semiconductor package; The film has a mold-releasing base material that will contact the hardening resin when forming the resin sealing part (but does not contain an antistatic agent) and an antistatic layer that will contact the mold when forming the resin sealing part; antistatic layer It contains at least one antistatic agent selected from the group consisting of conductive polymers and conductive metal oxides, and the total light transmittance of the release film is 80% or more. |
| priorityDate | 2014-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.