| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c0471c1ad9673129a5ebbea737bb2ee |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-508
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-405 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K9-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K9-238 |
| filingDate |
2018-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_229c9a088070459eb0376653df861789 |
| publicationDate |
2020-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I686563-B |
| titleOfInvention |
Micro led display and method of manufacturing the same |
| abstract |
A micro LED display and method of manufacturing the same. The micro LED display includes a wafer substrate, an adhesive layer, a plurality of light emitting components and a conductive structure. The wafer substrate includes a plurality of control circuits, wherein each control circuit has a conductive contact. The adhesive layer is disposed on the wafer substrate. The light emitting components includes a light emitting diode structures disposed on the adhesive layer. The conductive structure is electrically connected between the light-emitting diode structure and the control circuit, which are corresponding to each other. Thereby, the light emitting components having a plurality of light emitting diode structures and the wafer substrate with a plurality of control circuits can be connected to each other through the adhesive layer. |
| priorityDate |
2018-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |