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grantDate 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I685953-B
titleOfInvention Memory device using comb-like routing structure for reduced metal line loading
abstract A memory device includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes a first substrate and one or more peripheral device on the first substrate. The second semiconductor structure includes first group conductive lines electrically coupling to a first group of multiple vertical structures and second group conductive lines electrically coupling to a second group of multiple vertical structures. The second group of multiple vertical structures is different from the first group of multiple vertical structures. The first group conductive lines are vertically spaced apart from one end of the multiple vertical structures, and the second group conductive line are vertically spaced apart from an opposite end of the nmultiple vertical structures.
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