http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I685718-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_663cad2cddb9415ae5ba8d9c99803cda |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-168 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d6c4ca6f8a1cee642ff730d5951140e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d579e1128b23ead5fa82dfac6527ed22 |
| publicationDate | 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I685718-B |
| titleOfInvention | Method for forming solder resist pattern |
| abstract | An object of the present invention is to provide a method for forming a solder resist pattern, which in sequence includes at least the steps of forming a solder resist layer on a circuit board having at least connection pads, and thinning an unhardened solder resist layer until the resist The thickness of the solder layer is less than the thickness of the connection pad. In this forming method, the time required for the solder resist layer to be thinned can be shortened and productivity can be improved.nn n n n n A method for forming a solder resist pattern, characterized in that the alkaline aqueous solution used in the thinning step of thinning the uncured solder resist layer contains (A) an alkaline compound and (B) ammonium ions, and (B) ammonium ions are relatively The molar ratio (B/A) of the basic compound in (A) exceeds 0.00 and is less than 1.85. |
| priorityDate | 2016-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 184.