http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I685518-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ed77c3dbf88ed2c540f63dd17564661 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-06 |
| filingDate | 2018-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_393b73fcf349c22dbb3960cdd82278eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79f5688ebafec3ad50d4bbd6c71d945e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14f625e69082dfbf018aee54e4c20f5a |
| publicationDate | 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I685518-B |
| titleOfInvention | Circuit board and preparation method thereof |
| abstract | A circuit board includes a modified polyimide layer and a metal layer located on the modified polyimide layer, wherein the modified polyimide layer is made by the following steps: (1) Oxygen plasma treatment of the surface of a polyimide layer to obtain a treated polyimide layer; (2) covering the surface of the treated polyimide layer with a material and obtaining a covered polyimide layer with the material Comprising the silane compound represented by formula (I) and formula (II); and (3) baking the covered polyimide layer to obtain the modified polyimide layer. The adsorption force between the metal layer and the modified polyimide layer of the circuit board of the present invention can be effectively improved. |
| priorityDate | 2018-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.