http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I684121-B
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d107b8c914a989bbe5a9f5b6c2900a8c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_337feff6e2f2de979ba136cdde1c8158 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5342bd6d46c44242d0458b9cd600b424 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-50 |
filingDate | 2019-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c50ab2ad9b46dd12792e667477761d01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9690f3553c6e4658a8076ddfab22e2f |
publicationDate | 2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-I684121-B |
titleOfInvention | Curved surface self-alignment bonding device and method thereof |
abstract | The invention provides a curved surface self-alignment bonding device and method thereof, which comprises:a touch sensing layer, a flexible printed circuit board and a self-polymerizing resin. The touch sensing layer has a plurality of lower electrodes. The flexible printed circuit board and the touch sensing layer are disposed corresponding to each other, and the flexible printed circuit board has a plurality of upper electrode faces for the plurality of lower electrodes of the touch sensing layer. The self-polymerizing resin comprises a plurality of metal alloy particle spheres and a thermosetting polymer glue uniformly disposed between the touch sensing layer and the flexible printed circuit board. When pressing down the upper electrode of the flexible printed circuit board, the temperature of the self-assembly paste is increased by a heating method, make the metal alloy particles is melted, then the molten metal alloy particles will collecte between the upper electrode and the lower electrode, completed the bonding of the upper electrode and the lower electrode.The present invention also comprises a curved surface self-alignment bonding method. |
priorityDate | 2019-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.