| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec83ea8e6721b1a5654b038fdb9b223f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B2203-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2018-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_983e04fd21f7236969e90b4c0113ad50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1e4c6d48e70baab50fb5a65e27c7ff |
| publicationDate |
2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I683897-B |
| titleOfInvention |
Substrate processing method and substrate processing device |
| abstract |
A substrate processing method includes: a substrate holding step to hold a substrate having a surface exposed to metal; an inert gas replacement step to supply an inert gas near the surface of the substrate, thereby replacing the surface of the substrate with an inert gas The surrounding atmosphere; the adjustment step is to adjust the pH of the cleaning solution in such a way that the aforementioned metal does not react with the cleaning solution in an inert state or in a manner where the aforementioned metal reacts with the cleaning solution to form a passive state; After the atmosphere around the surface of the substrate is replaced with an inert gas, the pH-adjusted cleaning solution is supplied to the surface of the substrate. |
| priorityDate |
2017-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |