http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I683895-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 |
| filingDate | 2016-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_523e5f0c7418f04134cf08ce1d859e56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a0b5170fd0b55fb8c6d9c96fa1817a3 |
| publicationDate | 2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I683895-B |
| titleOfInvention | Silicon wafer polishing composition and polishing method |
| abstract | The purpose of the present invention is to reduce LPD in the final processing and grinding of silicon wafers, and prevent metal, especially nickel, copper pollution and grinding. The present invention provides a polishing composition, which is a polishing composition containing abrasive particles, a water-soluble polymer, a basic compound, a chelating agent, and water, and is characterized by the particle size of the particles present in the foregoing polishing composition In the distribution, the particle size corresponding to the cumulative volume of 10% from the side with a small particle diameter is set to D10, and the particle size corresponding to the cumulative volume of 50% from the side with a small particle size is D50, and When the particle size corresponding to the volume accumulation of 90% from the side with the small particle size is set to D90, the value of the parameter A of the coarse particle frequency defined by A=(D90-D50)/(D50-D10) is less than 1.7 , And used for the final processing and grinding of silicon wafer grinding. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I785550-B |
| priorityDate | 2015-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.