| abstract |
An object of an embodiment of the present invention is to provide a semiconductor substrate having an Au electrode pad and having excellent productivity, and a method for manufacturing the same. The semiconductor substrate according to the embodiment of the present invention includes an electroless Ni plating film / an electroless Pd plating film / an electroless Au plating film or an electroless Ni plating film / an electroless Au plating film on an Au electrode pad. The method for manufacturing a semiconductor substrate according to an embodiment of the present invention is to form an electroless Ni plating film / electrolytic Pd plating film / electroless Au on the Au electrode pad by the steps described in (1) to (6) below. The plating film, or electroless Ni plating film / electroless Au plating film, the following (1) to (6) are: (1) a degreasing step, (2) an etching step, (3) a pre-impregnation step, ( 4) Pd catalyst step, (5) electroless Ni plating step, and (6) electroless Pd plating step and electroless Au plating step, or electroless Au plating step. |