| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B17-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate |
2015-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27deedcad85dc9316cd910b2d40b8fbb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_221fa27a9e1d176b998d6542f6ff59fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda474f1bc68db4ae3463492369d5a3b |
| publicationDate |
2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I679241-B |
| titleOfInvention |
Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board |
| abstract |
The resin composition of the present invention contains an epoxy resin and a curing agent containing a first acid anhydride and a second acid anhydride. The unsaturated bond concentration represented by the following formula (1) of the second acid anhydride is 0.7% or less. The ratio of the number of acid equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is 0.05 or more and 0.5 or less, and the ratio of the total number of the acid anhydride equivalents of the first and second acid anhydrides to the number of epoxy equivalents is 0.5 or more 1.1 or less.nn n n Unsaturated bond concentration = ((the number of unsaturated bonds in one molecule / molecular weight) / the number of anhydride groups in one molecule) × 100 ... (1) |
| priorityDate |
2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |