| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e4d31a33b18b18472a0af1c2af038c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2018-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0564653498e54435e55794d4137f4d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2efb5963ffbf0ec5c88c79e621639ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a41aa93c085cc91f4049bb4a385d2f45 |
| publicationDate |
2019-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I678280-B |
| titleOfInvention |
Surface-treated copper foil and copper foil substrate |
| abstract |
The present invention discloses a copper foil having a low roughness property by roughening a matte surface through a roughening process, wherein the thickness of the copper foil is 5 μm (micrometer) to 70 μm (micrometer), and the surface of the roughened surface of the copper foil is The average roughness measured by the surface measuring instrument is 0.5 μm (micrometer) to 2.0 μm (micron), and the average roughness Rz JIS measured by the surface measuring instrument of the roughened matte surface of the copper foil is smaller than that of the copper foil. The average roughness of the glossy surface Rz JIS. The copper foil provided by the present invention has excellent resin adhesion and electrical properties, and has low roughness through surface roughening. |
| priorityDate |
2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |