http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I676194-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f8d5ee4a06179be6c04703536dee498 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-055 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29f2760a0f96609c4c5c2ec816402493 |
| publicationDate | 2019-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I676194-B |
| titleOfInvention | Stacked capacitor without using carbon glue layer, manufacturing method thereof, and silver glue layer |
| abstract | The invention discloses a stacked capacitor which does not require a carbon glue layer, a manufacturing method thereof, and a silver glue layer. The stacked capacitor includes a metal foil, an oxide layer, a polymer composite layer, and a silver glue layer. An oxide layer is formed on the outer surface of the metal foil to completely cover the metal foil. The polymer composite layer is formed on the oxide layer to partially cover the oxide layer. The silver glue layer is directly formed on the polymer composite layer to directly cover the polymer composite layer. Thereby, the oxide layer and the polymer composite layer can be connected to each other to form a first connection interface between the oxide layer and the polymer composite layer, and the polymer composite layer and the silver glue layer can be directly connected to each other without carbon. An adhesive layer to form a second connection interface between the polymer composite layer and the silver adhesive layer. |
| priorityDate | 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 143.