| abstract |
The present invention provides a photosensitive resin composition capable of obtaining a dry resist film having excellent migration resistance in the thickness direction and storage stability. The photosensitive resin composition of the present invention contains a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator, and a thermosetting agent. The thermosetting agent is a polycarbodiimide represented by formula (1). Compounds whose carbodiimide groups are protected by amine groups that will dissociate at temperatures above 80 ° C. The weight average molecular weight of the polycarbodiimide compound is 300 to 3000, and the carbodiimide equivalent is 150 to 600.n n n (In formula (1), R 1 , R 2 , X 1 , X 2 and n are the same as the definitions described in the description.) |