| abstract |
Embodiments of the present disclosure are directed to technologies and architectures for hybrid carbon-metal interconnect structures in integrated circuit components. In one embodiment, the device includes a substrate; a metal interconnect layer is disposed on the substrate and is constructed to serve as a growth start layer for a graphene layer; and the graphene layer, wherein the graphene layer is directly Ground is formed on the metal interconnection layer, and the metal interconnection layer and the graphene layer are constructed to form a routed electrical signal. Other embodiments may be described and / or claimed. |