| abstract |
An object of the present invention is to provide a resin composition including an insulating layer capable of suppressing warpage in a mounting step of a component.nn n n The resin composition of the present invention, which is a solution, contains (A) an epoxy resin, (B) a hardener, and (C) an inorganic filler, and (C) the component is a surface formed by a silane coupling agent and an alkoxysilane compound. When the mass ratio of the silane coupling agent to the alkoxysilane compound (the silane coupling agent: the alkoxysilane compound) is 1: 9 to 9: 1, and the non-volatile content in the resin composition is set to 100% by mass (C) The content of the component is 40% by mass or more. |