| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02041 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2015-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d57756de59cf2350f9f0bfbb9d16c56e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4f2bc37afbc104bf0c029921953df73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd1a6edd3797c789d009404275f02142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_564c6c351cff6a9b32f4bb49cf055e50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcf0202ccfaecd2434f22fb9c1dd3e55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f932ff4dbefa522f3153ef08cd0b46c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1bdfc9cbb1d18b25b2bd007bcd4a5fb |
| publicationDate |
2019-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I671139-B |
| titleOfInvention |
Substrate cleaning method and memory medium |
| abstract |
High particle removal performance can be achieved.nn n n The substrate cleaning method related to the implementation type includes a film formation process supply process and a removal liquid supply process. The film-forming treatment liquid supply engineering system supplies a film-forming treatment liquid containing an organic solvent and a polymer containing a fluorine atom and soluble in the organic solvent to a substrate. The removal liquid supply engineering system supplies a removal liquid for removing a treatment film to a treatment film formed by curing or hardening a film-forming treatment liquid on a substrate. |
| priorityDate |
2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |