| abstract |
The invention relates to a halogen-free thermosetting resin composition and a prepreg, a laminate, a metal-clad laminate, and a printed circuit board using the same. Based on 100 parts by weight of organic solids, the halogen-free thermosetting resin composition contains: (A) 25 to 55 parts by weight of a phosphorus-containing epoxy resin; (B) 10 to 40 parts by weight of an active ester curing agent; and (C) ) 20-50 parts by weight of bisphenol fluorene type benzoxazine resin. A laminate made of such a halogen-free thermosetting resin composition has high glass transition temperature, low dielectric loss factor, high heat resistance, low water absorption, and good flame retardancy, processability, and chemical resistance. |