| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2016-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f1e3617d1353eb1578564208107c5ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1be409847388efd7f80cdae7d8dc6346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dbe94375c465a0cc41825813d18885f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96ae301bae2b7c487afabf1554eb7c9f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b1c2066ed4d3dc734b8bfc1335db0f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82b2d70c652fa17c43e6f2f26c23bb41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7d5dfb65ebe624960c78d9da549ec50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7d006742fc500e508947e3ad51bd82a |
| publicationDate |
2019-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I669268-B |
| titleOfInvention |
MEMS package and method of forming same |
| abstract |
The MEMS package includes a complementary metal oxide semiconductor substrate, a MEMS substrate, and one or more conductive polysilicon vias. The complementary metal oxide semiconductor substrate has one or more semiconductor elements disposed in the semiconductor body. The MEMS substrate has a dynamic component, wherein the MEMS substrate is connected to the complementary MOS substrate by a conductive connection structure disposed on the front side of the MEMS substrate and located in the lateral direction of the self-dynamic component The location of the offset. One or more conductive polysilicon vias extend through the MEMS substrate to the conductive connection structure. |
| priorityDate |
2015-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |