| abstract |
The present invention provides a phenolic hydroxyl group-containing resin which is excellent in alkali developability and which exhibits high heat resistance, a method for producing the same, a photosensitive composition, a photoresist material, a coating film, a curable composition, and a cured product thereof. And the photoresist underlayer film. A phenolic hydroxyl group-containing resin characterized by containing a compound (A) having a molecular structure represented by the following structural formula (1), n n n In the formula, R 1 is an alkyl group, an alkoxy group or an aryl group, R 2 is a hydrogen atom, an alkyl group or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15; when m is 2 or more A plurality of R 1 's may be identical or different from each other. |