| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C279-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2016-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffac4234056b5b37c0636504a2f6987e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2ad1c3ad155342e38849d635d60ffc7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_894da4ad11c00c89991840908ea35edf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ead2537764d1990417bfa46a4de2e5d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8359c4c853057b99bce5c037942e42d |
| publicationDate |
2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I667376-B |
| titleOfInvention |
Electrolytic copper plating bath composition and method of use thereof |
| abstract |
The present invention relates to an acidic aqueous plating bath for the deposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconductors and glass devices for electronic applications. The electroplating bath according to the present invention comprises at least one source of copper ions, at least one acid, and at least one guanidine compound. The electroplating bath is particularly suitable for copper-plated concave structures and stacked copper pillar bump structures. |
| priorityDate |
2015-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |