| abstract |
The present invention provides systems and methods for forming a layer adjacent to a substrate using a slurry. Such layers may include, for example, iron, chromium, nickel, ruthenium, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and hafnium, oxides thereof, nitrides thereof, sulfides thereof, or One or more of the combinations. In some examples, the layers are stainless steel layers. |