http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I667281-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D491-113 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18 |
| filingDate | 2015-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d85b97aeaccdb3c3441ee5b61d2e00e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14d1cd30df744469e17a8e6688790705 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e52e3faaad0cb5184f65cc265817e0a8 |
| publicationDate | 2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I667281-B |
| titleOfInvention | Thermosetting resin composition |
| abstract | An object of the present invention is to provide a thermosetting resin composition which does not have a free isocyanate even when a carbodiimide compound is used, and a cured resin having high heat resistance is obtained.nn n n Moreover, an object of the present invention is to provide a thermosetting resin composition which can lower the curing temperature and which can be cured in a short time, and which has a high glass transition temperature of the obtained cured resin, and a cured resin thereof.nn n n The present invention relates to a thermosetting resin composition comprising (A) an epoxy resin (component A) and (B) a cyclic carbodiimide compound (component B), and/or (b) a biamine-based hardener (component b) represented by (bi), the cyclic carbodiimide compound (component B) comprising a carbodiimide group having a first nitrogen and a second nitrogen By forming a ring structure represented by the following formula (Bi) of the bond bond, the number of atoms forming the ring structure is 8 to 50, (wherein Q is an aliphatic group, an alicyclic group, an aromatic group or a combination thereof; that is, a bond having a valence of 2 to 4, and may also contain a hetero atom or a substituent; (wherein Ar 1 to Ar 4 are each independently a phenyl or naphthalene-diyl group which may be substituted by a substituent). |
| priorityDate | 2014-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.