| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e000ed5aabdb2248a1e5a269ab0e310e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-549
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 |
| filingDate |
2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e0493e5c89896aaaa4f5f076dd865b5 |
| publicationDate |
2019-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I666267-B |
| titleOfInvention |
Polyoxygenated gel composition |
| abstract |
The invention relates to a silicone gel composition for sealing or filling electrical or electronic parts, which comprises at least one adhesion promoter (Z), and is formed by curing at 25 ° C and a shear frequency of 0.1 Hz. 5.0 × 10 3 dyne / cm 2 to 1.0 × 10 5 dyne / cm 2 loss elastic modulus, 5.0 × 10 4 dyne / cm 2 to 1.0 × 10 6 dyne / cm 2 compound elastic modulus and 0.3 or Polysiloxane with loss tangent below 0.3. Provided is a polysiloxane gel composition that can suppress bubbles or cracks in a polysiloxane gel sealed or filled with electrical or electronic parts even when used under high temperature conditions, such as in a power device, as compared with conventional techniques. The appearance and combination with electrical or electronic parts is excellent; and a silicone gel is provided, which can suppress the occurrence of bubbles or cracks when sealing or filling electrical or electronic parts. |
| priorityDate |
2014-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |