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filingDate 2015-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I665729-B
titleOfInvention Surface modification of major chamber components used to reduce chamber particles
abstract The embodiments described herein relate generally to apparatus and methods for thermally treating chamber components used in ultraviolet semiconductor processing chambers. Heat treatment of chamber components containing a single ceramic or glass object can reduce the possibility of the generation of particulates when the chamber components are exposed to a corrosive environment, such as exposure to ultraviolet light and ozone / oxygen radicals. A method of heat-treating a chamber component includes heating a single object to a desired temperature at an acceptable ramp rate for a desired period of time, and then cooling the single object at the ramp rate.
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