| abstract |
The invention provides a method for cleaning and drying a semiconductor substrate without using a special device, which can suppress the pattern falling, collapse, and decomposition of the resin at the bottom of the pattern when the cleaning liquid after drying the substrate is dried, and the cleaning can be performed with good efficiency. The liquid was removed. A method for cleaning and drying a semiconductor substrate, comprising the following steps: (I) cleaning the patterned semiconductor substrate with a cleaning solution, (II) using a resin containing a repeating unit represented by the following general formula (1) (A ) And a solvent composition to replace the cleaning liquid remaining on the substrate, and the solvent in the substituted composition is heated and removed at a temperature not reaching the decomposition temperature of the resin (A); (III) maintaining A state in which the semiconductor substrate is at a temperature of 0 ° C or higher and the temperature does not reach the decomposition temperature of the resin (A), and a gas at a temperature higher than the decomposition temperature of the resin (A) is blown to the resin (A), whereby the resin (A) It is decomposed and removed from the surface side in contact with the gas. [Chemical 1] |