| abstract |
The invention provides a method for manufacturing an electronic component package. First, a semiconductor substrate is provided and an upper surface is etched to form a recess. A first insulating layer is formed above the upper surface and a sidewall of the recess. The conductive portion is filled with the recessed portion and the conductive connection pad is correspondingly connected to the conductive portion on the first insulating layer. An electronic component is arranged on the upper surface of the semiconductor substrate, wherein the electronic component has a connection pad to electrically connect the conductive connection pad to complete a semiconductor substrate with embedded connection lines. The semiconductor substrate is thinned from the lower surface to the upper surface, so that the conductive portion in the recess is exposed from the lower surface. A second insulating layer is formed under the lower surface and has an opening to expose the conductive portion. Finally, a rearranged metal circuit is formed under the second insulation layer, and a part of the rearranged metal circuit is located in the opening to electrically connect the conductive portion. |