http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I662638-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c0471c1ad9673129a5ebbea737bb2ee |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 2017-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_229c9a088070459eb0376653df861789 |
| publicationDate | 2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I662638-B |
| titleOfInvention | Semiconductor wafer repairing method and semiconductor wafer repairing device |
| abstract | The invention discloses a semiconductor wafer repairing method and a semiconductor wafer repairing device. A method for repairing a semiconductor wafer includes: providing a light-emitting diode module. The light-emitting diode module includes a circuit substrate and a plurality of light-emitting units. At least one of the light-emitting units is a damaged light-emitting unit. A laser light source generated by a laser generating module is projected to the damaged light-emitting unit to reduce the bonding force between the damaged light-emitting unit and the circuit substrate; then, a chip pick-and-place module is used to remove the damaged light-emitting unit from the circuit. The substrate is removed to form a vacancy. Next, a good light-emitting unit is placed in the vacancy by using a chip pick-and-place module. Next, the good light-emitting unit is electrically connected to the circuit substrate. Thereby, the damaged light-emitting unit can be replaced by a good light-emitting unit to achieve the effect of repair. |
| priorityDate | 2017-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559169 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID117559 |
Total number of triples: 21.